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Technology Articles

Datensätze 3.184
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Molex Launches VersaBeam EBO: A Plug-and-Play Fiber Solution for Data Centers

2025-07 Connectors Molex
[Jul 2 2025] The demand for faster, more reliable, and easier-to-maintain fiber connections is growing as hyperscale data centers expand. To keep up, Molex has introduced VersaBeam EBO, a plug-and-play expanded beam optical (EBO) connectivity solution designed to simplify deployment, reduce maintenance, and improve long-term reliability. Why VersaBeam EBO? Traditional fiber connectors are highly sensitive to ...
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Power Integrations introduces the TinySwitch-5 IC to help power efficient design

2025-03 Power Power Integrations
[Mär 26 2025] Power Integrations, a well-known company in the field of energy-efficient power conversion for high voltage integrated circuits, announced the introduction of TinySwitch™-5, extending the output power of its popular family of integrated offline switching ics to 175W. The new TinySwitch-5 uses simple diode rectification and optocoupler feedback to achieve up to 92% efficiency. More than 6 billion ...
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TDK integrates integrated telemetry into its latest DC-DC converter modules for high power density applications

2025-03 Connectors TDK
[Mär 26 2025] TDK has introduced the FS160* series of MicroPOL (μPOL) power modules, which offer superior power density and full telemetry in an ultra-compact size, and are now in mass production. These μPOL DC-DC converters provide enhanced performance while maintaining a very small footprint. Measuring just 3.3mm x 3.3mm x 1.35mm, each FS160* module is ideal for integration into designs with ASics, Measuring ...
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Microchip introduces the multifunctional MPLAB PICkit Basic debugger

2025-03 Semiconductors Microchip Technology
[Mär 25 2025] To enable more engineers to enjoy more powerful programming and debugging capabilities, Microchip Technology Inc. released the MPLAB PICkit Basic online debugger to provide a cost-effective solution for engineers at all levels. Compared to other complex and expensive debuggers, this economical tool offers high-speed USB 2.0 connectivity, CMSIS-DAP support, and compatibility with multiple integrat ...
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ADI releases an extended CodeFusion Studio solution to help accelerate product development and ensure data security

2025-03 Semiconductors Analog Devices
[Mär 25 2025] Analog Devices, Inc. has expanded its developer-focused suite with new solutions designed to help developers improve efficiency and security while creating greater value for customers. CodeFusion Studio System Planner helps customers innovate at the intelligent edge, improve functionality, and speed product to market. The new data traceability software development solution is designed to build a ...
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Vishay WSBE Power Metal Strip shunt resistors save space, simplify design and improve accuracy

2025-03 Passive Components Vishay
[Mär 25 2025] Vishay Intertechnology, Inc. announced the launch of a new line of AEC-Q200 certified Power Metal Strip shunt resistors, WSBE, with TCR as low as ± 10 ppm/°C, one of the lowest in its class. With resistance values as low as 15 μΩ and power ratings up to 50 W, the Vishay Dale WSBE family of devices is suitable for automotive, energy, industrial and space applications. These devices have ultra-low ...
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The new series of highly integrated wireless microcontrollers from ST STM32WBA6 offers more features, performance and energy efficiency

2025-03 Connectors STMicroelectronics
[Mär 24 2025] STMicroelectronics, the world's leading semiconductor company serving multiple electronic applications, has announced the next generation of STM32 energy-efficient short-range wireless microcontrollers (MCUS) that simplify the connectivity of consumer electronics and industrial devices to the Internet of Things. The STM32WBA6 new series of microcontrollers are used for iot smart devices, such as ...
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Nexperia introduces the 1200V SiC MOSFETs in the industry-leading top-cooling X.PIC package

2025-03 Semiconductors Nexperia
[Mär 24 2025] Nexperia has launched a series of highly efficient, stable and reliable industrial-grade 1200 V silicon carbide (SiC) MOSFETs. This family of devices performs well in terms of temperature stability and uses the innovative Surface Mount (SMD) top-cooling package technology X.PIC. The compact X.AK package, measuring only 14 mm ×18.5 mm, cleverly combines the convenient advantages of SMD technology ...
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Could supercapacitors disrupt the next generation of electric cars?

2025-03 Passive Components Littelfuse
[Mär 24 2025] Lithium-ion batteries have played an important role in the development of electric vehicles (EVs). Electric vehicles have become a sustainable means of transportation, but the ultimate vision of electric vehicles is still far away. Engineers and embedded system professionals are looking for better power through supercapacitors. Some experts believe that supercapacitors are a solution that can all ...
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An iot platform for generative AI applications is unveiled

2025-03 Semiconductors Memsic Inc.
[Mär 21 2025] MediaTek launches high-performance Genio 720 and Genio 520 edge ai iot platforms. These new products in the Genio family support the latest generative AI models, HMI, multimedia and connectivity capabilities for smart home, retail, industrial and commercial iot devices. With superior edge performance and built-in Mediatek 8th-generation NPU, these devices offer up to 10 TOPS, providing full hardw ...
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Provide advanced BBUS for AI data centers to power AI roadmap

2025-03 Power Infineon Technologies
[Mär 21 2025] Infineon Technologies AG has presented a roadmap for a next-generation battery backup unit (BBU) solution that can be used for the uninterrupted operation of artificial intelligence data centers to avoid the risk of power outages and data loss. The BBU solution is designed to provide efficient, reliable, scalable power conversion for AI server racks with power density up to 400% of the industry a ...
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Renesas Electronics Corporation has introduced a new device aimed at the high-volume visual artificial intelligence market

2025-03 Semiconductors Renesas Electronics America
[Mär 21 2025] Renesas Electronics Corporation has introduced a new device aimed at the high-volume visual artificial intelligence market, extending its RZ/V family of microprocessors. Similar to the high-end RZ/V2H, the new RZ/V2N MPU is equipped with the company's proprietary AI accelerator DRP-AI3, which boasts 10 TOPS/W power efficiency and up to 15 TOPS AI inference performance through its advanced pruning ...