Technology Articles

2012-03 Semiconductors IDT, Integrated Device Technology

[Mär 3 2012] IDT Corporation announced that it has introduced a new family of low-jitter silicon germanium (SiGe) surface acoustic (SAW) voltage-controlled oscillators (VCSO). Complementary to IDT's popular M675 series and high performance timing portfolio, the new product family is designed with higher frequency low jitter oscillators to meet the stringent requirements of fiber optic telecommunications appli ...

2012-03 Power Renesas Electronics America

[Mär 2 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...

2012-03 Power Intel

[Mär 1 2012] There is never enough capacity for AMD, and there often seems to be excess at Intel. At the end of 2010, Intel announced that it would use the new 22nm process to manufacture FPGA chips for Archronix Semiconductor, and subsequently set up a dedicated Foundry "Intel Custom Foundry". Now, Intel has won a second contract customer, or to manufacture 22nm FPGas for people. Tabula Inc., a provider of p ...

2012-02 Connectors Infineon Technologies

[Feb 29 2012] Infineon Technologies has introduced a new family of XMC4000 32-bit microcontrollers using ARM® Cortex™-M4 processors. Infineon has used more than 30 years of experience in developing application-optimized peripherals with excellent real-time capabilities to design the XMC4000 product family, which combines the benefits of a widely adopted kernel architecture. The XMC4000 product family addresses ...

2012-02 Connectors Microchip Technology

[Feb 28 2012] Microchip Technology announced the launch of a new family of 16-bit PIC24 Lite microcontroller (MCU) that combines ultra-low power (XLP) technology, low price, and low pin count packages, making it ideal for the most cost-sensitive applications in consumer, medical, and security. The PIC24F "KL" series has a typical hibernation current of 30 nA at 25 ° C and a typical operating current of 150 μA/ ...

2012-02 Connectors NXP

[Feb 27 2012] NXP Semiconductors announced the introduction of the LPC1100LV series, the world's first ARM® Cortex™-M0 microcontroller that supports dual supply voltages from 1.65V to 1.95V VDD and 1.65V to 3.6V VIO. The LPC1100LV series is available in a 2mm x 2mm micro package with performance up to 50 MIPS and power consumption more than three times lower than comparable 3.3V VDD devices. The LPC1100LV plat ...

2012-02 Semiconductors TE Connectivity

[Feb 26 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced the availability of reflow Solderable thermal protection (RTP) devices for rated AC (AC) and rated DC (DC) with a 140°C disconnect temperature (TOPEN). The innovative RTP devices enable quick and easy installation using industry-standard component mount and lead-free reflow equipment, ensuring manufacturers achieve signifi ...

2012-02 Semiconductors Broadcom

[Feb 25 2012] Broadcom announced the launch of the world's first 5G WiFi system-on-a-chip (SoC), the BCM43460, further strengthening its leadership and strong momentum in the 5G WiFi chip market. The BCM43460 is designed to meet the growing need for gigabit interconnection in enterprise networks, wireless cloud networks and carrier access networks. The BCM43460 System on a Chip (SoC) is based on the new IEEE 8 ...

2012-02 Semiconductors STMicroelectronics

[Feb 24 2012] STMicroelectronics expands the SLLIMM(Low Loss Intelligent Micro Die Block) product line with the introduction of two new micro motor drive modules that improve the energy efficiency level of home appliances. ENERGY efficiency marks and energy efficiency rating marks, such as the ENERGY STAR mark and the energy efficiency rating mark for electrical goods, are mandatory industry standards in some ...

2012-02 Semiconductors Lattice Semiconductor Corporation

[Feb 23 2012] Lattice Semiconductor announced that it has shipped more than 20 million programmable mixed-signal devices. The adoption of major mixed-signal device families is growing globally, including Lattice Power Manager II, the newly released Platform Manager™, and the ispClock™ family. Lattice programmable mixed-signal devices can be used in a variety of applications, from low-cost solid-state drives to ...

2012-02 Connectors TE Connectivity

[Feb 22 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced a new family of eight single/multichannel silicon electrostatic discharge (SESD) protection devices that deliver the lowest capacitance on the market (bi-directional: typical value 0.10pF, unidirectional: Typical value is 0.20pF), highest ESD protection (20kV air discharge and contact discharge) and smallest package size ( ...

2012-02 Optoelectronics STMicroelectronics

[Feb 21 2012] STMicroelectronics will enable compact digital cameras and smartphones to meet user requirements for increased built-in flash output power while supporting more advanced user control features. The new chip STCF04 is a built-in flash/flashlight dual-mode camera flash controller that can increase the maximum power of the LED flash module from today's general power design of a few watts to more than ...