Technology Articles

2023-04 Semiconductors NXP

[Apr 25 2023] NXP Semiconductor announced the launch of the new 28nm RFCMOS radar single-chip family for next-generation ADAS and autonomous driving systems. The new SAF85xx single-chip family integrates NXP's high-performance radar sensing capabilities and processing technology to provide Tier 1 suppliers and Oems with increased flexibility to support short -, medium - and long-range radar applications to mee ...

2023-04 Semiconductors Infineon Technologies

[Apr 25 2023] Infineon Technologies has introduced a new 3.3 x 3.3 mm2 PQFN package with source base power mosFETs to achieve the highest level of performance and power density in the design of future power electronics systems. The voltage range covers 25-150 V, and there are two different structures: bottom cooling (BSC) and double cooling (DSC). The new product family delivers significant performance improve ...

2023-04 Semiconductors Vishay

[Apr 25 2023] Vishay Intertechnology has announced the availability of two new seventh generation 1200V FRED Pt® Hyperfast recovery rectifiers --VS E7MH0112-M3 and VS-E7MH0112Hm3. These two 1 A rectifiers are packaged in SMA (DO-214AC) package, with reverse recovery charge (Qrr) and forward voltage drop reaching the advanced level of similar devices. Vishay Semiconductors VS E7MH0112-M3 and the AEC-Q101-certif ...

2023-04 Semiconductors STMicroelectronics

[Apr 25 2023] STMicroelectronics has introduced ACEPACK™ SMIT packaged power semiconductor devices in a variety of common bridge topologies. ST advanced ACEPACK™ SMIT package simplifies assembly and increases module power density compared TO traditional TO packages. This package greatly improves the power density. The area of the top insulation and cooling surface is 32.7mm x 22.5mm, the creepage distance betw ...

2023-04 Semiconductors Renesas Electronics America

[Apr 25 2023] Renesas Electronics announced the launch of a new automotive class Intelligent power device (IPD) that provides safe and flexible control of power distribution within the vehicle to meet the requirements of a new generation of E/E (Electrical/electronic) architecture. The new RAJ2810024H12HPD comes in a small To-252-7 package, which reduces the installation area by about 40% compared TO tradition ...

2023-04 Semiconductors Samsung

[Apr 25 2023] Samsung Electronics has launched its latest 200 megapixel (200MP) image sensor, ISOCELL HP2, whose advanced pixel technology and full well capacity will deliver an amazing image experience for future high-end smartphone devices. With a 0.6 micron (μm) size appearance and 1/1.3 inch optical format, it can accommodate 200 megapixels. This is the sensor configuration widely used in high-end smartpho ...

2023-04 Connectors Samsung

[Apr 24 2023] Samsung has announced production readiness for high-performance PCIe 4.0 NVMe SSD (solid state drive) PM9C1a. The PM9C1a is a new memory product based on Samsung's 5 nanometer (nm) high-end technology and seventh generation V-NAND technology, which will significantly improve the computing and gaming performance of PCS and laptops. The Samsung PM9C1a SSD will be available in a variety of capacity ...

2023-04 Power Samsung

[Apr 24 2023] Samsung Electronics announced that it has successfully developed its first 16 Gb DDR5 DRAM built with 12 nanometer (nm) level technology, and completed a product evaluation with AMD for compatibility. Based on the latest DDR5 standard, Samsung's 12nm level DRAM will unlock speeds of up to 7.2 gigabits per second (Gbps). That means processing two 30GB UHD movies in one second. Jooyoung Lee, senior ...

2023-04 Semiconductors Infineon Technologies

[Apr 24 2023] Infineon Technologies has partnered with Green Hills Software, a global leader in embedded security, to provide a complete ecosystem for the development and deployment of advanced security applications in the automotive industry. The partnership combines Infineon's leading TRAVEO™ T2G family of body and dashboard microcontrollers with Green Hills' comprehensive, production-proven software solutio ...

2023-04 Semiconductors Infineon Technologies

[Apr 24 2023] Infineon Technologies and Uplander (pmd), a quality partner specializing in 3D ToF, have launched the IRS2875C image sensor, a performance advanced version of the IRS2975C. The industry's first image sensor based on Infineon's latest pixel technology, it works using time-of-flight (ToF) technology known as indirect time-of-flight (i-ToF). The IRS2975C's small size and performance are tailored for ...

2023-04 Power FTDI, Future Technology Devices International Ltd

[Apr 24 2023] FTDI Chip's FT4232HA High speed USB to UART/MPSSE IC. The FT4232HA is a car-standard USB 2.0 to UART adapter IC that seamlessly provides high-speed USB support for target designs. With four separate configurable interfaces, the FT4232HA device provides a highly flexible solution for a range of automotive and general USB applications, including smart card readers, industrial controls, media player ...

2023-04 Semiconductors Analog Devices

[Apr 24 2023] Analog Devices(ADI) announced the launch of a new precision medium-bandwidth signal chain platform that improves system performance in DC to approximately 500kHz signal bandwidths for industrial and instrumentation applications. The new platform offers a complete set of signal chains with customizable solution options and comes with a select set of development tools, such as LTspice emulation, to ...