Technology Articles
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X-FAB introduces backlighting technology for its CMOS sensor process platform
2024-06
Power
XMOS
[Jun 1 2024] X-FAB is one of the world's leading specialty semiconductor foundries, focused on providing customers with high-performance analog and mixed-signal semiconductor solutions. As technology continues to advance and market demands continue to increase, X-FAB continues to innovate and improve on its technology platform to meet the diverse needs of its customers. Recently, X-FAB announced the introduct ...

Infineon Technologies launches 400 V MOSFET series targeting AC/DC power conversion for AI servers
2024-05
Connectors
Infineon Technologies
[Mai 31 2024] Due to the growing power demands of Artificial Intelligence (AI) processors, server power supply (PSUs) need to provide increasing amounts of power while still fitting within the specified dimensions of server racks. The increase in energy demand for high-level GPUs is the main driving force behind this trend. It is projected that by the end of the decade, each chip could consume 2 kW or more. In ...

Infineon introduces the next generation CoolGaN transistor family based on the 8-inch foundry process
2024-05
Connectors
Infineon Technologies
[Mai 31 2024] Infineon Technologies AG has introduced two new iterations of high voltage (HV) and medium voltage (MV) CoolGaN devices. These advancements allow customers to utilize Gallium Nitride (GaN) in voltage ranges spanning from 40 V to 700 V. This expanded range of applications contributes to the promotion of digitalization and decarbonization. Both of these product families are produced using advanced ...

The efficiency of recovering electricity from heat storage is 44%
2024-05
Power
AKM Semiconductor Inc.
[Mai 31 2024] University of Michigan (U-M) research indicates that devices capable of converting heat into electricity are approaching the theoretical maximum efficiency, making them increasingly viable for usage on the grid.Thermal solar cells can be used to convert intermittent renewable energy into electricity and store it in heat batteries during peak production hours. Andrej Lenert, an associate professor ...

TSMC introduces a new series of low bias current and high efficiency Zener diodes
2024-05
Passive Components
Taiwan Semiconductor Corporation
[Mai 30 2024] Taiwan Semiconductor has introduced a new line of Zener diodes that offer a range of regulated voltages from 1.8VDC to 1 39VDC. These diodes have an extremely low bias current (IZT) of 50µA and a maximum power dissipation (PD) of 500mW. These devices are well-suited for situations where there is a need for extremely low bias current (to prolong battery life), a requirement (for energy harvesting) ...

New automotive synchronous buck converter for light load, low noise and isolation applications
2024-05
Connectors
STMicroelectronics
[Mai 30 2024] STMicroelectronics has unveiled automotive-qualified step-down synchronous DC/DC converters that offer space-saving benefits and facilitate integration in many applications, such as body electronics, audio systems, and inverter gate drivers. The A6983 converters provide versatile design options, including six non-isolated step-down converters with low power consumption and low noise versions, as ...

Nexperia now offering SiC MOSFETs in D2PAK-7 SMD package
2024-05
Power
Nexperia
[Mai 29 2024] Nexperia has recently introduced their highly advanced 1200 V silicon carbide (SiC) MOSFETs in D2PAK-7 surface mount device (SMD) packaging. These MOSFETs are available in four different options with RDSon values of 30, 40, 60, and 80 mΩ. Nexperia recently released two separate SiC MOSFETs in 3 and 4-pin TO-247 packaging in late 2023. This announcement is part of a series of releases that will qu ...

ST introduces motor control demo boards for advanced industrial and consumer products
2024-05
Connectors
STMicroelectronics
[Mai 29 2024] The EVSPIN32G4-DUAL demonstration board from STMicroelectronics enables the control of two motors using a single STSPIN32G4 integrated driver. This board facilitates product development and streamlines the design of the printed circuit board (PCB) and the bill of materials (BOM). The EVSPIN32G4-DUAL board reduces the time required to bring innovative industrial and consumer products, including as ...

Littelfuse introduces IX4352NE low side gate drivers for SiC MOSFETs and high power IGBTs
2024-05
Connectors
Littelfuse
[Mai 28 2024] Littelfuse announces IX4352NE low-side SiC MOSFETs and IGBT gate drivers. This innovative driver is specifically designed to drive silicon carbide (SiC) MOSFETs and high power insulated gate bipolar transistors (IGBTs) in industrial applications. The main advantage of the IX4352NE is its independent 9A pull/fill current output, which supports tailor-made on and off timing while minimizing switchi ...

Lidar chip technology development Application of LiDAR in unmanned driving
2024-05
Connectors
Knowles
[Mai 28 2024] The background of LiDAR (light detection and ranging) technology can be traced back to the 1960s. It was originally developed to solve range measurement and terrain mapping problems. Early LiDAR systems were mainly used in earth science and atmospheric research, such as measuring cloud height and concentration, and monitoring the diffusion of pollutants. With the progress of technology and the in ...

Eaton introduces 48-volt DC/DC converters designed for harsh environments
2024-05
Connectors
Eaton
[Mai 27 2024] Eaton has announced that it is offering a higher power version of its low-voltage 48-volt DC/DC converter for commercial and off-road vehicles, which is designed to withstand the harsh environments in which these vehicles are driven. Ben Karrer, Engineering Director of Low Voltage and Power Conversion Products at Eaton's Vehicle and Vehicle Electrification Group, said: "Our new converters have an ...

Samsung is about to mass-produce 3nm Exynos processors to challenge Apple and TSMC
2024-05
Connectors
Samsung
[Mai 27 2024] Samsung Electronics recently announced that they will soon begin mass production of Exynos processors using a 3-nanometer process technology. This significant development not only marks a big step for Samsung in semiconductor manufacturing, but also means that it will directly challenge major competitors in the market, such as Apple and TSMC. Samsung's 3nm Exynos processor uses the more advanced ...