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Nexperia introduces its rapidly expanding line of copper-clip FlatPower (CFP) packaged diodes

Apr 20 2023 2023-04 Power Nexperia
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Nexperia announced the introduction of the latest addition to its rapidly expanding FlatPower (CFP) line of encapsulated diodes for industrial and automotive applications. This latest product contains 32 planar Schottky diodes and 8 ultra-fast recovery rectifier diodes, all packaged in CFP15B. Includes general models and devices with Q in accordance with AEC-Q101 vehicle specification standards

     Nexperia announced the introduction of the latest addition to its rapidly expanding FlatPower (CFP) line of encapsulated diodes for industrial and automotive applications. This latest product contains 32 planar Schottky diodes and 8 ultra-fast recovery rectifier diodes, all packaged in CFP15B. Includes general models and devices with Q in accordance with AEC-Q101 vehicle specification standards. By bringing multiple versions of the device to market, Nexperia underscores its commitment to expanding capacity and accelerating the transition to smaller and thermally-optimized packages. It gives engineers access to the broadest portfolio of CFP packaged diodes on the market from just one supplier.

     These new planar Schottky diodes operate in the range of 30-100 V and 3-15 A. Versions (VF) optimized for low forward voltage (including PMEG100V080ELPE/-Q) provide low on-off losses and high efficiency in anti-backlash applications, enabling cost-effective DC-DC converters. These diode parts are also available in low-leakage current versions with ultra-low reverse current and excellent high-temperature performance, providing excellent robustness and preventing thermal runaway. Eight 200 V single-channel fast recovery rectifier diodes (PNE200xxEPE/-Q series) carry an average forward current (IF) of 4-10 A and complement Nexperia's existing two-channel fast recovery rectifier diodes.

     Using this smaller, more power-dense CFP15B package instead of a DPAK or SMB/C package not only maintains the same level of electrical performance, but also saves up to 60% of board space. This durable package design extends the operating time of diode parts and improves board level reliability. Its optimized pin spacing ensures uniform solder joint distribution and improves automatic optical detection (AOI) performance. This solution is particularly suitable for modern ADAS, EV, LED lighting or ECU applications that rely on advanced high-density design.

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