Texas Instruments' new product line continues to push the limits of power design

Texas Instruments has introduced two new lines of power conversion devices that help engineers achieve higher power in a smaller space, delivering ultra-high power density at a lower cost. Texas Instruments' new 100V integrated Gallium nitride (GaN) power stage features heat-enhanced double-sided cooling package technology that simplifies thermal design for medium-voltage applications and enables ultra-high power densities (more than 1.5kW/in3). Texas Instruments' new 1.5W isolated DC/DC module integrates transformers with the industry's highest power density and ultra-small size to help engineers reduce the size of isolated auxiliary power supplies in automotive and industrial systems by more than 89%.

Kannan Soundarapandian, general manager of Texas Instruments' High Voltage Power Supply Business unit, said: "Delivering higher power in a limited space is always a key design challenge for power supply designers. In the case of data centers, if engineers can design server power solutions with high power density, data centers can operate more efficiently to meet growing processing demands while reducing their environmental impact to a greater degree. We are excited to continue to push the limits of power management through our innovations that enable engineers to deliver ultra-high power density, efficiency and thermal performance."

Increase power density and efficiency with the 100V integrated GaN power stage

 With Texas Instruments' new 100V GaN power stages LMG2100R044 and LMG3100R017, and thanks to the higher switching frequency of GaN technology, designers can reduce the size of power solutions for medium-voltage applications by more than 40%. And achieve superior power density (higher than 1.5kW/in3). The new product family also reduces switching power consumption by 50 percent compared to silicon-based solutions and achieves system efficiency of 98 percent or more given lower output capacitance and lower gate drive losses. For example, in photovoltaic inverter systems, higher density and efficiency allow the same solar panel to store and generate more electricity, while reducing the size of the entire micro-inverter system.

 A key element in guaranteeing the thermal performance of the 100V GaN product family is Texas Instruments' heat-enhanced double-sided cooling package. With this technology, the device can dissipate heat from both sides more efficiently than comparable integrated GaN devices and provide optimized thermal resistance.

Reduce the auxiliary power supply size by more than 89%

 With more than eight times the power density of vertical solutions and three times the power density of comparable modules, Texas Instruments' new 1.5W isolated DC/DC module delivers ultra-high output power and isolation (3kV) for automotive and industrial systems in a 4mm x 5mm VSON package. With the Texas Instruments UCC33420-Q1 and UCC33420, designers can easily meet stringent electromagnetic interference (EMI) requirements, such as the International Special Committee on Radio Interference (CISPR) 32 and 25, using fewer components and simple filter designs.

 These new modules use Texas Instruments' next-generation integrated transformer technology, eliminating the need for external transformers in the auxiliary power design. Compared to discrete solutions, this technology enables engineers to reduce solution size by more than 89% and height by up to 75%, while cutting the bill of materials in half.

 Now, with advanced solutions in such small packages and compliant with automotive standards, designers can reduce the size, weight and height of auxiliary power solutions for electric vehicle systems, such as battery management systems. For space-constrained industrial power delivery in data centers, the new module enables designers to reduce the printed circuit board area to a greater extent.