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Technology Articles

Datensätze 2.426
Seite 5/203
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TI introduces new embedded processors and analog chips based on bulk acoustic wave (BAW) technology

2024-03 Power Texas Instruments
[Mär 14 2024] Texas Instruments is a leading global semiconductor company whose products are used in a wide range of electronic devices. In the field of semiconductor technology, Bulk Acoustic Wave (BAW) technology is a solution that can provide higher performance, smaller size and lower power consumption. BAW technology uses the propagation characteristics of sound waves in solid media to realize the function ...
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Vishay upgraded TFBS4xx and TFDU4xx series infrared transceiver modules

2024-03 Power Vishay
[Mär 14 2024] Vishay Intertechnology has announced the introduction of upgraded TFBS4xx and TFDU4xx series infrared (IR) transceiver modules for IrDA applications, extending the link distance by 20% and increasing ESD resistance to 2 kV. The device supports 115.2 kbit/s data rate (SIR) with a link distance of 1 meter and is suitable for energy meters and monitors, industrial automation control, wireless commun ...
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Infineon introduces a new solid-state isolator that offers faster switching and up to 70% lower power consumption

2024-03 Connectors Infineon Technologies
[Mär 13 2024] Infineon Technologies introduces a new range of solid-state isolators. The series enables faster, more reliable circuit switching and offers protection not available with optical solid-state relays (SSRS). Using coreless transformer technology, these isolators support up to 20 times higher energy transmission while providing current and temperature protection for greater reliability and lower cos ...
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Infineon introduces the second generation of CoolSiC MOSFETs, setting new standards in power electronics

2024-03 Connectors Infineon Technologies
[Mär 13 2024] In today's society highly dependent on electricity, power loss has become a key factor that cannot be ignored in the field of power electronics. In response to industry demand for more efficient and reliable power processing solutions, Infineon Technologies AG has introduced its new silicon Carbide CoolSiC MOSFET G2 trench technology. This technology sets a new standard for power transmission eff ...
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Infineon enhances the Traveo T2G MCU family with Qt graphics solutions for intelligent rendering technology

2024-03 Connectors Infineon Technologies
[Mär 12 2024] In the highly competitive global semiconductor market, manufacturers have been working to reduce time to market. At the same time, their demand for smooth, high-resolution graphics displays is growing. To address these market needs, Infineon Technologies AG has announced a strategic partnership with the Qt Group. Qt Group is a global software company that provides cross-platform solutions for the ...
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STMicroelectronics introduces flexible synchronous rectifier controllers

2024-03 Connectors STMicroelectronics
[Mär 12 2024] The SRK1004 Synchronous rectifier controller simplifies the design of power converters using silicon-based or GaN transistors and improves conversion efficiency for applications including industrial power supplies, portable device chargers, and AC/DC adapters. The SRK1004's detection input can withstand voltages up to 190V and can be connected to high-low power switch tubes. With four products to ...
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STMicroelectronics introduces STM32WBA5 series microcontrollers

2024-03 Connectors STMicroelectronics
[Mär 11 2024] ST announced the launch of the new STM32WBA5 series of microcontrollers, which not only inherits the STM32 family's tradition of performance, energy efficiency and ease of use, but also significantly improves wireless connectivity and security to meet the growing demand for Internet of Things devices. The STM32WBA5 series microcontrollers have a built-in Arm Cortex-M33 core running at up to 100MH ...
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Ceva introduces the next generation of low-power ultra-wideband IP for FiRa 2.0

2024-03 Sensors Cree Inc.
[Mär 11 2024] Ceva, a leading global IP licensee of silicon products and software that helps smart edge devices connect, sense and infer data more reliably and efficiently, announced the full availability of RivieraWaves ultra-wirelessly enabled (UWB) IP products for FiRa 2.0. FiRa 2.0 is the latest technical specification released by the FiRa Industry Alliance to promote widespread adoption of UWB-driven appl ...
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AMD released a new FPGA: upgrade 16nm, power consumption dropped 60%

2024-03 Semiconductors Amgis
[Mär 10 2024] In the latest development in the technology industry, AMD announced the launch of a new FPGA (Field Programmable Gate Array) product, this time with significant performance improvements and reduced power consumption. In the continuous technological innovation and close market competition, AMD's move undoubtedly adds new chips to the company's position in the semiconductor field. The new generatio ...
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AI wave drives the evolution of memory chips

2024-03 Optoelectronics ABLIC
[Mär 9 2024] The wave of artificial intelligence (AI) is surging across the globe, with an incredibly powerful force for change. From the Internet, finance, healthcare, education, and transportation, the influence of AI has penetrated into various fields, and it is changing the way we live and changing our perception of the world. However, behind this huge change, there is a technical foundation that is quiet ...
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How can MCUS improve system performance in robot motor control design

2024-03 Connectors MaxBotix Inc.
[Mär 9 2024] In the development of modern robot technology, the motor control system plays a crucial role. Microcontroller (MCU) is the core of motor control system, and its performance directly affects the motion accuracy, efficiency and stability of robot. Therefore, how to improve the performance of robot motor control system by MCU technology is an important research direction in the field of robot design ...
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Texas Instruments' new product line continues to push the limits of power design

2024-03 Power Texas Instruments
[Mär 8 2024] Texas Instruments has introduced two new lines of power conversion devices that help engineers achieve higher power in a smaller space, delivering ultra-high power density at a lower cost. Texas Instruments' new 100V integrated Gallium nitride (GaN) power stage features heat-enhanced double-sided cooling package technology that simplifies thermal design for medium-voltage applications and enables ...