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Technology Articles

Datensätze 2.426
Seite 6/203
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BrainChip and VVDN launch edge AI box to accelerate multi-domain intelligence process

2024-03 Power Bridgelux
[Mär 8 2024] With the increasing maturity of artificial intelligence technology, edge computing is gradually becoming a key force to promote the process of intelligence. Edge AI chip manufacturer BrainChip has announced that it has further expanded the edge AI market by offering its chips in "edge box" devices through ODM VVDN India. Edge box is a small, independent system for artificial intelligence accelera ...
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Nexperia introduces a new generation of low-voltage analog switches

2024-03 Power Nexperia
[Mär 7 2024] Nexperia, a global specialist in high-capacity production of basic semiconductor devices, announced the launch of a new family of 4 - and 8-channel analog switches dedicated to monitoring and protecting 1.8V electronic systems. The family of multiplexers includes AEC-Q100 certified models for automotive applications, as well as standard versions for a wider range of consumer and industrial applic ...
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Micron begins mass production of industry-leading HBM3E solutions to accelerate AI development

2024-03 Power Micron Technology Inc.
[Mär 7 2024] Micron Technology, a leading global provider of memory and storage solutions, announced that it has begun mass production of its HBM3E high-bandwidth memory solution. The NVIDIA H200 Tensor Core GPU will feature Micron's 8-layer stacked 24GB capacity HBM3E memory and begin shipping in the second quarter of 2024. With this milestone, Micron continues to lead the industry and enables artificial int ...
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Infineon and VMAX strengthen cooperation to provide energy-efficient and economical fast charging services for electric vehicles

2024-03 Semiconductors Infineon Technologies
[Mär 6 2024] Infineon Technologies AG's new CoolSiC hybrid discrete devices feature TRENCHSTOP 5 fast-switching IGBTs and CoolSiC Schottky diodes. Shenzhen VMAX New Energy Co., LTD. (VMAX), a leading manufacturer of power electronics and motor drives for new energy vehicles in China, is using this device for its next-generation 6.6kW OBC/DCDC on-board charger. In a D²PAK package, Infineon's components combine ...
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Littelfuse offers an ultra-compact, encapsulated, magnetic-reed switch solution for space-constrained designs

2024-03 Passive Components Littelfuse
[Mär 6 2024] Littelfuse Corporation is an industrial technology manufacturing company dedicated to powering a sustainable, connected and safer world. The company introduces the 59177 series of ultra-small, encapsulated magnetic spring switches that provide designers with unmatched flexibility to meet the needs of space-constrained applications. With its compact design and low power consumption, the 59177 seri ...
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Lattice updates O-RAN stack to promote 5G small cell development

2024-03 Semiconductors Lattice Semiconductor Corporation
[Mär 5 2024] Lattice Semiconductor Corporation announced the latest update to its Lattice O-RAN stack, bringing low power consumption and flexible bridging capabilities to 5G small cell sites. This update marks an important step for Lattice in advancing the development of 5G technology. With the latest update, Lattice has introduced a new 5G data path reference design for outdoor integrated radio applications ...
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Renesas is geared towards the next generation of robots with visual AI and real-time control capabilities

2024-03 Connectors Renesas Electronics America
[Mär 5 2024] Renesas Electronics has announced the launch of a new product for high-performance robotics applications, the RZ/V2H, further expanding its popular RZ family of microprocessors (MPUs). The RZ/V2H delivers the highest level of performance in the product family, enabling visual AI and real-time control. The RZ/V2H is equipped with Renesas' new proprietary AI accelerator DRP-AI3 (Dynamically Configu ...
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Intel has launched a new vPro platform to extend the benefits of AI PCS to the commercial sector

2024-03 Power Intel
[Mär 4 2024] Intel, the world's leading semiconductor company, has been pushing the boundaries of technological innovation, seeking to apply the most advanced technology to various fields. Recently, they launched their new vPro platform, and this time, they have their eyes on the commercial market in an attempt to extend the advantages of artificial intelligence (AI) PCS to this area. This decision will undou ...
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Vishay introduces IGBT power modules in INT-A-PAK package with improved design to reduce on-off and switching losses

2024-03 Passive Components Vishay
[Mär 4 2024] Vishay Intertechnology announced, Introduced five new half-bridge IGBT power modules in an improved INT-A-PAK package -VS-GT100TS065S, VS-GT150TS065S, VS-GT200TS065S, VS-GT100TS065N and VS-GT200TS065N. Manufactured using Vishay's Trench IGBT technology, these new devices offer designers two industry-leading technology options - low VCE(ON) or low Eoff - to reduce high current inverter level on-of ...
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Wafer-level fabrication of high-precision microoptical components produced in fingertip sized chips by X-ray lithography

2024-03 Sensors Infineon Technologies
[Mär 1 2024] X-ray lithography plays an important role in chip manufacturing. It uses the short-wavelength properties of X-rays to produce high-precision micro-optical components in finger-sized chips. The emergence of this precision manufacturing technology has provided a strong driving force for the development of the microelectronics industry. X-ray lithography begins by cutting a piece of pure silicon mat ...
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Flexible dual-modal sensor for robot tactile and non-contact distance perception

2024-03 Sensors ON Semiconductor
[Mär 1 2024] As technology continues to advance, the application of artificial intelligence and machine learning is also increasing. An important research direction in these areas is the development of flexible bi-modal sensors that can be used for tactile and non-contact distance perception in robots. The flexible dual-mode sensor has two sensing modes of touch and distance, allowing the robot to better perc ...
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Ams OSram empowers automotive smart surfaces with advanced optical sensing technology

2024-02 Power ams
[Feb 27 2024] Ams OSram, as the world's leading optoelectronic solutions provider, has been committed to driving the intelligent development of the automotive industry through innovative technologies. With the rapid development of smart cars, the interaction mode in the car is also constantly evolving. Ams OSram uses advanced optical sensing technology and surface capacitive touch sensing technology to empower ...