NXP PMIC - Power Management - Spezialisiert
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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 4/20
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Anwendungen | Stromversorgung | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
PF4210 |
6.432 |
|
- | Audio, Video | - | 2.8V ~ 4.5V | 0°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8.388 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
7.668 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
8.532 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8.442 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC PWR MGMT I.MX35/51 139BGA |
22.332 |
|
- | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
|
|
|
NXP |
FS6500 |
7.488 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V |
6.372 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC RECEIVER 16KB FLASH 32QFN |
6.468 |
|
- | Wireless Power Receiver | 120mA | 3.5V ~ 20V | - | Surface Mount | 32-UFQFN Exposed Pad | 32-QFN (5x5) |
|
|
|
NXP |
IC PWR MGMT I.MX7 6LDO QFN 48 |
6.264 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
4.536 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
TRANSFORMER PHYSICAL LAYER |
25.696 |
|
- | Isolated Communications Interface | 40mA | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
7.434 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8.478 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SBC, DCDC 1.5A VCORE FS1B CAN,15 |
7.830 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
PROGRAMMABLE SOLENOID CONTROLLER |
6.048 |
|
- | Automotive | 150µA | 5V ~ 72V | -40°C ~ 125°C (TA) | Surface Mount | 80-LQFP Exposed Pad | 80-LQFP (12x12) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
5.778 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC PWR MGMT I.MX35/51 186BGA |
25.034 |
|
- | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
|
|
|
NXP |
POWER MANAGEMENT IC FOR LOW-POWE |
6.750 |
|
- | Microcontroller, MCU | - | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 25-UFBGA, WLCSP | 25-WLCSP (2.09x2.09) |
|
|
|
NXP |
IC POWER MANAGEMENT |
8.262 |
|
* | - | - | - | - | - | - | - |
|
|
|
NXP |
IC USB POWER MANAGER 20-QFN |
5.364 |
|
- | OR Controller, UART/USB Data, Audio Management | 9µA | 2.7V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN-EP (3x4) |
|
|
|
NXP |
IC USB POWER MANAGER 20-QFN |
2.988 |
|
- | OR Controller, UART/USB Data, Audio Management | 9µA | 2.7V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN-EP (3x3) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
6.282 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
6.516 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
PF1510 |
5.904 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
3.042 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
4.176 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
8.982 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
5.796 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
5.238 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |