NXP PMIC - Power Management - Spezialisiert
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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 6/20
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Anwendungen | Stromversorgung | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
4.482 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
3.582 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
5.418 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
7.992 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
8.136 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
LOW-COST ONE-CHIP 5 V QI WIRELES |
3.348 |
|
- | Wireless Power Transmitter | 2mA | 3.4V ~ 5.25V | -20°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
|
|
|
NXP |
IC RECEIVER 16KB FLASH 32QFN |
5.778 |
|
- | Wireless Power Receiver | 120mA | 3.5V ~ 20V | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (3.07x2.98) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3.942 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
6.912 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3.418 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3.618 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
6.174 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
PF1510 |
6.102 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
2.520 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
5.076 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
6.426 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
6.660 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
3.582 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
2.988 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
4.086 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
5.364 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
3.492 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
4.968 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
2.610 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
4.464 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
8.676 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
7.920 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
7.218 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
8.712 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
3.420 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |