NXP PMIC - Power Management - Spezialisiert
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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 5/20
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Anwendungen | Stromversorgung | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
IC PWR MGMT I.MX7 6LDO QFN 48 |
2.106 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
4.770 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
4.500 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
4.590 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
8.820 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
4.662 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
PF1510 |
8.010 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
7.542 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
7.686 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
2.214 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
7.578 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
5.886 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
6.642 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
5.742 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
3.508 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
4.752 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 18V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
7.218 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 18V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3.798 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
5.400 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
2.970 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
8.946 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
7.488 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
7.272 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
5.400 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
5.724 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
3.222 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
6.012 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
2.124 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
6.642 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
8.100 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |